ThermalManagement_Ultra96-V2-G.pdf (1.56 MB)
Analysis of Thermal Management and Cooling DC Fan of Ultra96-V2-G Multi Processor Single Board Computer
This paper presents the analysis of thermal management and cooling DC fan,which cools multi-cores (four cores of Cortex A53 and two cores of Cortes R5F) processor system on a chip and associated components mounted on a single board computer of XCZU3EG-1SBVA484E by forced convection, optimizing the design, operational conditions and maximizing the performance.
Funding
SELF FUNDED
History
Email Address of Submitting Author
abhishekbansaL006@gmail.comORCID of Submitting Author
https://orcid.org/0000-0002-2572-9004Submitting Author's Institution
New Era Consultancy ServicesSubmitting Author's Country
- India
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- Aerospace
- Bioengineering
- Communication, Networking and Broadcast Technologies
- Components, Circuits, Devices and Systems
- Computing and Processing
- Engineered Materials, Dielectrics and Plasmas
- Engineering Profession
- General Topics for Engineers
- Power, Energy and Industry Applications
- Robotics and Control Systems
- Signal Processing and Analysis
- Transportation
Keywords
heatsinkpassive heatsinkAavidforced coolingFEMFEAconvectionflang mountbearingCFMRPMDC FanFinite Element AnalysisAVNETUltra96-V2-GZynqUltraScale+MPSoCXCZU3EGXCZU3EG-1SBVA484EwobblingLevitationMagnetic LevitationMagLevimpeller rotorthermal characteristicsJunction-to-Ambientheat fluxparabolic velocity profilelaminar flowthermal energyspatialHeat Transfermoving airJESD51-6EIAThermal Resistanceactive heatsinkCOMSOLMATLABAUTOCADAltiumSimulinkPLECSFEMAMultiPhysics96boardLinarofailurefireshort circuitconductionforceextrusionpadsSOLIDWORKSradiationstresstensorstress tensorviscousthermal expansionvelocity vectorpressurelatentspecific heatfluidCFDfluid dynamics modelingpolynomialcurrent loop compensatorSMPSgrid storagevoltage loop compensatorBoost