Analysis of Void Formation Mechanism in the Vacuum Reflow Soldering
Process of Semiconductor Laser Diode
Abstract
In this paper, the vacuum reflow soldering technology for semiconductor
laser chips in optoelectronic devices was studied and analyzed in a
systematic manner. Through the study on the key elements in the reflow
soldering process, such as the selection of solders, chamber vacuum,
flux, and the pressure applied by the fixture on the chip, this paper
focused on exploring the formation mechanism of voids in the solder
layer when the device was resoldered. Also, the change in the movement
of gas bubbles in the voids with changing reflow oven chamber conditions
and its underlying law were analyzed, by preparing 200 C-package
semiconductor laser diodes and verifying the reliability and stability
of the theoretical analysis through inspection and test aging. which
could provide a theoretical basis for the use of the vacuum reflow
soldering technology to reduce the void rate in the soldering process of
devices.