VirtualThermalSensor_20211112.pdf (2.51 MB)

Virtual Thermal Sensor for Real-Time Monitoring of Electronic Packages in a Totally Enclosed System

preprint

posted on 2021-11-13, 10:28 authored by Chang-uk AhnChang-uk Ahn, Hwi-Su Kim, Seungin Oh, Jin-Gyun Kim, Dong Il Park

This paper presents a virtual thermal sensor for real-time monitoring of electronic packages in a totally enclosed system.

Funding

National Research Foundation of Korea (NRF-2018R1A1A1A05078730)

MOTIE, Korea Government (grant No. 20001228)

History

Email Address of Submitting Author

changuk.ahn@gmail.com

ORCID of Submitting Author

0000-0003-4679-6537

Submitting Author's Institution

Kyung Hee University and Korea Institute of Machinery and Materials

Submitting Author's Country

South Korea

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Categories

Computing and Processing

Keywords

Virtual thermal sensor electronic packages finite element method Inverse Heat Conduction Problem Tikhonov regularization.ridge estimator

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