Bo Pu is currently a visiting assistant professor of EMC Laboratory at Missouri Univ.of Science and Technology.
He received the B.S. degree in electrical engineering from the Harbin Institute of Technology, China, in 2009, and the Ph.D. degree in electronic and electrical engineering from Sungkyunkwan University, South Korea, in 2015. From 2015 to 2020, he worked for Foundry Business, Semiconductor R&D of Samsung Electronics, Hwaseong, Korea, as a Staff Engineer. His research interests include the design methodology for chip-package-PCB systems in areas of signal/power integrity and EMC. He holds 10 patents about high speed links and 2.5D/3D ICs.
Dr. Pu was the recipient of Best Student Paper Award at the IEEE APEMC 2011, Young Scientists Award from the URSI in 2014, and the 2019 Distinguish reviewer for IEEE Trans. on EMC. He served as a Session Chair in IEEE APEMC 2017, IEEE EMC+SIPI 2020, and a TPC Member of the Joint IEEE EMCS & APEMC 2018. He is an Associate Editor of IEEE Access