JL
Publications
- https://doi.org/10.3390/cryst9120650
- https://doi.org/10.1364/OE.26.010162
- https://ieeexplore.ieee.org/document/7824526
- https://doi.org/10.3390/cryst12050632
- http://www.engineeringletters.com/issues_v28/issue_3/EL_28_3_03.pdf
- https://doi.org/10.7567/JJAP.56.011701
- https://doi.org/10.33166/aetic.2020.03.001
- https://doi.org/10.1117/12.2570001
- https://doi.org/10.1117/12.2593624
- https://ieeexplore.ieee.org/document/9337967
- https://ieeexplore.ieee.org/document/9816384
- https://ieeexplore.ieee.org/document/9331345
- https://ieeexplore.ieee.org/document/9331555
- https://ieeexplore.ieee.org/document/9567615
- https://ieeexplore.ieee.org/document/9199680
- https://iopscience.iop.org/article/10.1088/1757-899X/892/1/012057
- https://doi.org/10.33166/AETiC.2021.04.002
- https://doi.org/10.33166/AETiC.2022.03.001
- https://ieeexplore.ieee.org/document/9202604
- https://ieeexplore.ieee.org/document/7821401
- https://ieeexplore.ieee.org/document/8931720
- https://ieeexplore.ieee.org/document/9330818
- https://ieeexplore.ieee.org/document/9244313
- https://doi.org/10.1007/978-3-030-60036-5_7
- https://doi.org/10.48550/arXiv.2005.03599
- https://doi.org/10.3390/electronics12020421
- https://ieeexplore.ieee.org/document/10002683/
- https://ieeexplore.ieee.org/document/9998660