loading page

Virtual Thermal Sensor for Real-Time Monitoring of Electronic Packages in a Totally Enclosed System
  • +2
  • Chang-uk Ahn ,
  • Hwi-Su Kim ,
  • Seungin Oh ,
  • Jin-Gyun Kim ,
  • Dong Il Park
Chang-uk Ahn
Kyung Hee University and Korea Institute of Machinery and Materials

Corresponding Author:[email protected]

Author Profile
Hwi-Su Kim
Author Profile
Seungin Oh
Author Profile
Jin-Gyun Kim
Author Profile
Dong Il Park
Author Profile


This paper presents a virtual thermal sensor for real-time monitoring of electronic packages in a totally enclosed system.
2022Published in IEEE Access volume 10 on pages 50589-50600. 10.1109/ACCESS.2022.3174208