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A Critical Review of Interconnect Options for SIW Technologies
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  • Asif Alam,
  • Muhmmad Shah Alam,
  • Khalid AlMuhanna,
  • Atif Shamim
Asif Alam

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Muhmmad Shah Alam
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Khalid AlMuhanna
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Atif Shamim
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Abstract

Despite extensive research on integrating Substrate Integrated Waveguide (SIW) technologies with conventional transmission technologies such as Microstrip Transmission Line (MSTL), Co-planar Waveguide (CPW), Rectangular Waveguide (RWG), and Coaxial lines, a comprehensive evaluation and design framework has yet to be explored. This review addresses this critical gap by providing a detailed examination of recent advancements in interconnect technologies at millimeter-wave (mmWave) frequencies. The paper identifies unresolved challenges and introduces a novel Figure-of-Merit (F oM) designed to evaluate and decide the state-of-the-art in interconnect technologies. Furthermore, it proposes a novel design flow that aids interconnect designers by integrating reported advances into a well-defined process. As such, the study provides a basis for further developments in this area and uses the advantages of existing technologies and SIW to ease the integration on mmWave systems.
21 May 2024Submitted to TechRxiv
30 May 2024Published in TechRxiv