A Handy Novel Impedance Standard Substrate for Calibration of both
Horizontal and Vertical Interconnects by Radio Frequency and Microwave
Probes
Abstract
This article proposes a novel impedance standard substrate, as known as
calibration kit, 17 for the calibration using radio frequency (RF) and
microwave probes, especially the through 18 substrate which is able to
calibrate not only the conventional horizontal but also the vertical 19
interconnects on the basis of the short-open-load-through (SOLT)
standardized calibration 20 approach. In the measurement of a vertical
connection where the probing ports are located on the 21 opposite
surfaces of devices, a location change or rotate with the probes is
required after the 22 calibration based on the conventional coplanar kit
which only allows the probing in the same 23 plane. The location change
or rotation of the probes and corresponding connected cables 24
inevitably affects the precision of the calibration since the probes and
cables are sensitive to the 25 surroundings. Our proposed calibration
kit can overcome the aforementioned shortcomings, and 26 the comparison
of calibrated results between conventional and proposed through
impedance 27 standard substrate is demonstrated. Validation of the
proposed kit based on the coplanar meander 28 lines and vertical
couplings by via arrays is also discussed.