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FeFET-Based Content-Addressable Storage Class Memory: Device Variation and High-Temperature Compatibility
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  • Athira Sunil ,
  • Masud S K Rana ,
  • Maximilian Lederer ,
  • Yannick Raffel ,
  • Franz Müller ,
  • Ricardo Olivo ,
  • Raik Hoffmann ,
  • Konrad Seidel ,
  • Thomas Kämpfe ,
  • Bhaswar Chakrabarti ,
  • Sourav De
Athira Sunil
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Masud S K Rana
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Maximilian Lederer
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Yannick Raffel
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Franz Müller
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Ricardo Olivo
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Raik Hoffmann
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Konrad Seidel
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Thomas Kämpfe
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Bhaswar Chakrabarti
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Sourav De
Fraunhofer IPMS

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Hafnium oxide (HfO2)-based ferroelectric field effect transistors (FeFETs) have revolutionized the emerging non-volatile memory
area, especially with the potential to replace flash memories for several applications. In this article, we investigate the suitability of FeFETs memories, especially FeFET-based content addressable memory (CAM)-cells, as storage class memory under junction temperature variations. FeFETs with silicon oxynitride interfacial layer have been fabricated and characterized at various temperatures, varying from room temperature to 120◦C. Although the memory window, numbers of programmable states, and endurance deteriorate at high temperatures, FeFETs show excellent robustness in data retention, write latency, and read stability at all temperatures, especially for binary operation. Finally, system SPICE simulations using experimental data were conducted to gauge the robustness of the data-search operation using the CAM array under different temperatures. Despite temperature-variation-induced changes in FeFET devices, we have observed that binary CAM cells perform robust and unerring search operations for storing and searching data at temperatures up to 120 °C.