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Improved Numerical Estimation Method for Surface Wave Attenuation on Metasurfaces
  • +3
  • Kota Suzuki,
  • Phuc Toan Dang,
  • Ashif A. Fathnan,
  • Haruki Homma,
  • Sendy Phang,
  • Hiroki Wakatsuchi
Kota Suzuki
Department of Engineering, Nagoya Institute of Technology
Phuc Toan Dang
Department of Engineering, Nagoya Institute of Technology

Corresponding Author:[email protected]

Author Profile
Ashif A. Fathnan
Department of Engineering, Nagoya Institute of Technology
Haruki Homma
Department of Engineering, Nagoya Institute of Technology
Sendy Phang
Faculty of Engineering, George Green Institute for Electromagnetics Research, University of Nottingham
Hiroki Wakatsuchi
Department of Engineering, Nagoya Institute of Technology

Abstract

We present comprehensive numerical tools to investigate and analyze the surface wave attenuation on a metasurface waveguide that consists of periodic patches deposited on a dielectric substrate. The surface wave attenuation is evaluated in both waveguide and openspace environments at high frequencies around the 28-GHz band. We, first, employ two approaches including a driven modal approach and an integrated eigenmode approach for investigating the attenuation behaviors in a metasurface waveguide operating in transverse electromagnetic (TEM) mode. These results show different attenuation values depending on the waveguide height due to an unavoidable coupling issue despite the same metasurface design. Thus, we propose an alternative method for more accurately evaluating the frequencydependent attenuation characteristics through field distribution in open-space with a customized horn antenna. We establish a relationship between the surface wave attenuation and the propagation distance by analyzing the analytical electric field distribution at different points on the propagation path in the open space. Thus, this study provides an improved method for assessing surface wave attenuation characteristics, which contributes to designing surface wave control for wireless communications, wireless power transfer, signal processing, and electromagnetic compatibility.
04 Jan 2024Submitted to TechRxiv
10 Jan 2024Published in TechRxiv