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Analytical electro-thermal model and 3-D thermal resistance network for SMD-based printed circuit board power converters
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  • Talis Piovesan,
  • Edemar O. Prado,
  • Hamiltom C. Sartori,
  • José R. Pinheiro
Talis Piovesan
Federal University of Bahia, Federal Institute Farroupilha

Corresponding Author:[email protected]

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Edemar O. Prado
Federal University of Bahia, Federal University of Santa Maria

Corresponding Author:[email protected]

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Hamiltom C. Sartori
Federal University of Santa Maria
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José R. Pinheiro
Federal University of Bahia, Federal University of Santa Maria
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Abstract

This work presents an analytical electro-thermal model for SMD-based printed circuit board (PCB) power converters. Temperature-dependent component losses are derived from analytical models and a 3-D thermal resistance network is employed to characterize the temperatures across components and PCB paths. Furthermore, the work explores the mechanical and thermal interaction within the PCB paths, concurrently analyzing semiconductor switches and the power inductor in synchronous commutation cell configurations. The proposed model undergoes evaluation with two different PCB layouts of a synchronous boost converter, operating at 350 kHz with 50 W and 75 W. Model-generated temperatures are compared with experimental measurements using a thermal imaging camera and with Finite Elements Analysis (FEA) in Ansys Icepak. The acquired results validate the accuracy of the proposed model.
22 Feb 2024Submitted to TechRxiv
22 Feb 2024Published in TechRxiv