Abstract

Vertical conductive structure (VeCS) technology, an advanced interconnect technology for signal transition on different printed circuit board (PCB) layers, was developed to meet needs for more intelligent PCB technologies with decreased layer count, and improved signal integrity and power integrity with respect to those of conventional transition via structures. In contrast to the conventional via structure, the VeCS consists of a plate signal trace and an oval-shaped shielding ground racket comprising a semi-coaxial structure or a vertical transmission line. The VeCS achieves a continuous characteristic impedance that improves electrical performance regarding losses, crosstalk, and electromagnetic interference. Herein, the physical structure of the VeCS is first introduced. Subsequently, the time domain reflectometer impedance of the VeCS is extracted and analyzed through full-wave simulations. The crosstalk between VeCS-based and via-based channels on the PCB is compared to clarify the advantages of VeCS technology. Finally, measurements are used to further demonstrate the advantages of VeCS technology.